US 10,462,909 B2
Wiring board manufacturing method and wiring board manufacturing device
Kenji Tsukada, Toyota (JP); Masatoshi Fujita, Anjo (JP); Yoshitaka Hashimoto, Kariya (JP); Akihiro Kawajiri, Chiryu (JP); and Masato Suzuki, Chiryu (JP)
Assigned to FUJI CORPORATION, Chiryu-shi (JP)
Appl. No. 15/524,128
Filed by FUJI CORPORATION, Chiryu-shi (JP)
PCT Filed Nov. 14, 2014, PCT No. PCT/JP2014/080244
§ 371(c)(1), (2) Date May 3, 2017,
PCT Pub. No. WO2016/075823, PCT Pub. Date May 19, 2016.
Prior Publication US 2018/0302991 A1, Oct. 18, 2018
Int. Cl. H05K 3/00 (2006.01); H05K 3/12 (2006.01); B33Y 50/02 (2015.01); B29C 64/124 (2017.01); B29C 64/393 (2017.01); B41M 3/00 (2006.01); B41M 7/00 (2006.01); B29C 64/112 (2017.01); B29C 64/336 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B29L 31/34 (2006.01); H05K 1/09 (2006.01)
CPC H05K 3/1283 (2013.01) [B29C 64/112 (2017.08); B29C 64/124 (2017.08); B29C 64/336 (2017.08); B29C 64/393 (2017.08); B33Y 50/02 (2014.12); B41M 3/006 (2013.01); B41M 7/0081 (2013.01); H05K 3/0014 (2013.01); H05K 3/0055 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3425 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12); H01L 2924/0002 (2013.01); H05K 1/097 (2013.01); H05K 3/0085 (2013.01); H05K 2203/013 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/107 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A wiring board manufacturing method comprising:
a resin layer forming step of forming a resin layer by applying a UV-curable resin ink and applying UV light to the applied resin ink;
a wiring layer forming step of forming a wiring layer by applying a conductive ink on the resin layer and applying a laser light or a pulse light including a continuous spectrum to the applied conductive ink;
wherein
the wiring board is manufactured by layer building the resin layer and forming the wiring layer by performing the resin layer forming step and the wiring layer forming step in a predetermined order, and
in a case in which the wiring layer forming step is performed directly after performing the resin layer forming step, during the prior resin layer forming step, the UV light is applied such that an integral light amount is a first integral light amount, and
in a case in which another resin layer forming step is performed consecutively directly after performing the resin layer forming step, during at least a portion of the prior resin layer forming step, the UV light is applied such that the integral light amount is a second integral light amount that is smaller than the first integral light amount.