US 10,462,904 B2
Electronic component mounting package and electronic device
Takayuki Shirasaki, Omihachiman (JP)
Assigned to Kyocera Corporation, Kyoto (JP)
Filed by KYOCERA Corporation, Kyoto-shi, Kyoto (JP)
Filed on Nov. 15, 2018, as Appl. No. 16/192,240.
Application 16/192,240 is a continuation of application No. 15/754,670, filed on Feb. 23, 2018, granted, now 10,136,517.
Claims priority of application No. 2015-231706 (JP), filed on Nov. 27, 2015.
Prior Publication US 2019/0269014 A1, Aug. 29, 2019
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/18 (2006.01); G02F 1/035 (2006.01); G02F 1/225 (2006.01); G02F 1/03 (2006.01); H01L 23/04 (2006.01); H01L 23/02 (2006.01)
CPC H05K 1/181 (2013.01) [G02F 1/035 (2013.01); G02F 1/0327 (2013.01); H01L 23/02 (2013.01); H01L 23/04 (2013.01); H01L 2224/48091 (2013.01)] 14 Claims
OG exemplary drawing
1. An electronic component mounting package, comprising:
a housing including
a body portion comprising an upper surface disposed with an concave portion, a lower surface disposed with a notched portion, and a through hole extending from a bottom surface of the concave portion to a bottom surface of the notched portion, and
a projecting ridge portion located on the bottom surface of the notched portion;
a terminal comprising an upper end projecting through the through hole into an interior of the concave portion and a lower end projecting into an interior of the notched portion; and
a flexible substrate extending from the interior of the notched portion to an exterior of the notched portion, the flexible substrate being joined to the terminal, the flexible substrate abutting on the projecting ridge portion to be bent.