US 10,462,903 B2
Electronic device and method for assembling the same
Hyun Woo Sim, Gyeonggi-do (KR); and Yong Hwa Kim, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd, (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Aug. 10, 2016, as Appl. No. 15/233,489.
Claims priority of application No. 10-2015-0112644 (KR), filed on Aug. 10, 2015.
Prior Publication US 2017/0048990 A1, Feb. 16, 2017
Int. Cl. H05K 1/00 (2006.01); H05K 1/14 (2006.01); G06F 1/16 (2006.01); H04M 1/02 (2006.01)
CPC H05K 1/147 (2013.01) [G06F 1/1626 (2013.01); G06F 1/1637 (2013.01); G06F 1/1656 (2013.01); H04M 1/026 (2013.01); H04M 1/0274 (2013.01); H05K 2201/056 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/0228 (2013.01)] 19 Claims
OG exemplary drawing
1. An electronic device comprising:
a display substrate including a screen area and a peripheral area in which a first conductive pattern is formed, the peripheral area surrounding at least a portion of the screen area;
a connector on which a second conductive pattern is formed, the connector including a curved portion;
a conductive bonding layer disposed between the peripheral area of the display substrate and the connector, and electrically connecting the first conductive pattern and the second conductive pattern; and
a cutting part disposed through the display substrate, the conductive bonding layer, and the connector,
wherein the cutting part includes a first portion surrounded by the peripheral area of the display substrate, and a second portion surrounded by the curved portion of the connector.