US 10,462,901 B1
Implementing embedded wire repair for PCB constructs
Samuel Connor, Apex, NC (US); Stuart B. Benefield, Durham, NC (US); Matthew S. Doyle, Chatfield, MN (US); Joseph Kuczynski, North Port, FL (US); and Jonathan Jackson, Cedar Grove, NC (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Jul. 26, 2018, as Appl. No. 16/46,518.
Int. Cl. H05K 3/42 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01)
CPC H05K 1/115 (2013.01) [H05K 1/0251 (2013.01); H05K 1/09 (2013.01); H05K 3/0047 (2013.01); H05K 3/42 (2013.01); H05K 2201/09681 (2013.01); H05K 2203/163 (2013.01); H05K 2203/173 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for implementing embedded wire repair for printed circuit board (PCB) constructs comprising:
providing a printed circuit board (PCB) having an embedded repair wire layer in a PCB construct within a PCB stack with reference planes on opposite sides of the repair wire layer;
detecting erroneous wiring of said embedded repair wire layer in the PCB construct;
drilling an appropriate plated through hole (PTH) in the PCB stack for forming a repair connection in the erroneous wiring of said embedded repair wire layer;
wherein providing said embedded repair wire layer within the PCB stack includes providing multiple individual embedded wires within said embedded repair wire layer isolated from all other wiring layers; and
wherein providing said multiple individual embedded wires isolated from all other wiring layers includes routing respective individual embedded wires to respective plated through holes (PTHs) in the PCB stack.