US 10,462,900 B2
Glass fiber coatings for improved resistance to conductive anodic filament formation
Bruce J. Chamberlin, Vestal, NY (US); Matthew S. Kelly, Oakville (CA); Scott B. King, Rochester, MN (US); and Joseph Kuczynski, North Port, FL (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Nov. 30, 2016, as Appl. No. 15/364,938.
Prior Publication US 2018/0153042 A1, May 31, 2018
Int. Cl. H05K 3/00 (2006.01); H05K 1/03 (2006.01); C08J 5/24 (2006.01); C03C 25/34 (2006.01); C08J 5/08 (2006.01); C09D 171/12 (2006.01)
CPC H05K 1/0366 (2013.01) [C03C 25/34 (2013.01); C08J 5/08 (2013.01); C08J 5/24 (2013.01); C08J 2371/12 (2013.01); C09D 171/12 (2013.01); H05K 2201/0769 (2013.01); H05K 2203/0759 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A process of improving resistance to conductive anodic filament (CAF) formation, the process comprising:
dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution, the base resin material including one or more peroxide initiators;
applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process; and
removing the solvent via a thermal process that partially converts the base resin material, resulting in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material, the prepreg matrix material including a polyphenylene oxide (PPO)-based matrix material;
forming a prepreg material; and
incorporating the prepreg material into the manufacturing of a printed circuit board,
wherein, during one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent conductive anodic filament (CAF) formation pathways.