US 10,462,856 B2
High frequency heating apparatus
Hoikwan Lee, ChungCheongNam-Do (KR); Kyungmin Yoon, ChungCheongNam-Do (KR); and Seo-Yeong Cho, ChungCheongNam-Do (KR)
Assigned to Corning Precision Materials Co., Ltd., Asan-si, Chungcheongnam-do (KR)
Filed by SAMSUNG CORNING PRECISION MATERIALS CO., LTD., Gyeongsangbuk-do (KR)
Filed on Mar. 5, 2013, as Appl. No. 13/786,240.
Claims priority of application No. 10-2012-0022640 (KR), filed on Mar. 6, 2012.
Prior Publication US 2013/0233848 A1, Sep. 12, 2013
This patent is subject to a terminal disclaimer.
Int. Cl. H05B 6/64 (2006.01); H05B 6/70 (2006.01); H05B 6/78 (2006.01); C03B 29/08 (2006.01); F27B 9/36 (2006.01); F27D 11/12 (2006.01); F27D 99/00 (2010.01)
CPC H05B 6/64 (2013.01) [C03B 29/08 (2013.01); F27B 9/36 (2013.01); F27D 11/12 (2013.01); F27D 99/0006 (2013.01); H05B 6/70 (2013.01); H05B 6/78 (2013.01); F27D 2099/0026 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A high frequency heating apparatus comprising a plurality of high frequency generators disposed over a glass substrate to be carried in a first direction and spaced apart from each other in the first direction, each of the plurality of high frequency generators generating high frequency to heat the glass substrate, the high frequency ranging from 0.98 GHz to 6.0 GHz,
wherein a distance from the glass substrate to each of the plurality of high frequency generators is (n═/2)*λ, where n′ is a natural number ranging from 1 to 6, and λ is a wavelength of the high frequency.