US 11,793,041 B2
Display device having a slit passing through the second flattening film
Tohru Okabe, Sakai (JP); Ryosuke Gunji, Sakai (JP); Kohji Ariga, Aioi (JP); Hiroki Taniyama, Sakai (JP); Shinji Ichikawa, Sakai (JP); Shinsuke Saida, Sakai (JP); Hiroharu Jinmura, Yonago (JP); Akira Inoue, Yonago (JP); Yoshihiro Kohara, Yonago (JP); Koji Tanimura, Yonago (JP); and Yoshihiro Nakada, Yonago (JP)
Assigned to SHARP KABUSHIKI KAISHA, Sakai (JP)
Appl. No. 17/57,567
Filed by SHARP KABUSHIKI KAISHA, Sakai (JP)
PCT Filed May 22, 2018, PCT No. PCT/JP2018/019682
§ 371(c)(1), (2) Date Nov. 20, 2020,
PCT Pub. No. WO2019/224917, PCT Pub. Date Nov. 28, 2019.
Prior Publication US 2021/0210583 A1, Jul. 8, 2021
Int. Cl. H10K 59/121 (2023.01); H10K 59/131 (2023.01); H10K 50/84 (2023.01); H10K 50/844 (2023.01)
CPC H10K 59/131 (2023.02) [H10K 50/841 (2023.02); H10K 50/844 (2023.02); H10K 59/1213 (2023.02)] 19 Claims
OG exemplary drawing
 
1. A display device comprising:
a base substrate;
a TFT layer which is provided on the base substrate and in which a first metal film, a first inorganic insulating film, a second metal film, a second inorganic insulating film, a third metal film, a first flattening film, a fourth metal film, and a second flattening film are sequentially layered;
a light-emitting element included in a display region and provided on the TFT layer; and
a frame region provided on a periphery of the display region;
the light-emitting element including a plurality of first electrodes provided on the second flattening film, a plurality of light-emitting element layers provided on the plurality of first electrodes respectively, and a second electrode provided to be shared on the plurality of light-emitting element layers,
wherein in the frame region, a slit passing through the second flattening film is formed in the second flattening film to surround the display region,
a first conductive layer formed by the fourth metal film is provided on the first flattening film exposed from the slit, and
a TFT included in a drive circuit is provided on the base substrate side of the first conductive layer to overlap with the first conductive layer.