US 11,792,932 B2
Component carrier with embedded magnetic inlay and integrated coil structure
Ivan Salkovic, Zagreb (HR); Gerald Weidinger, Leoben (AT); and Johannes Stahr, St. Lorenzen im Mürztal (AT)
Assigned to AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed by AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed on Dec. 11, 2020, as Appl. No. 17/247,469.
Claims priority of application No. 19218727 (EP), filed on Dec. 20, 2019.
Prior Publication US 2021/0195749 A1, Jun. 24, 2021
Int. Cl. H05K 1/05 (2006.01); H05K 3/06 (2006.01); H01F 27/06 (2006.01); G11B 5/21 (2006.01); G11B 5/127 (2006.01); G11B 5/147 (2006.01); G01D 5/14 (2006.01); H01Q 7/06 (2006.01); H05K 1/16 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/165 (2013.01) [H01F 27/06 (2013.01); H05K 3/101 (2013.01); H05K 3/4652 (2013.01); H01F 2027/065 (2013.01); H05K 2201/086 (2013.01); H05K 2201/10265 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a component carrier, comprising:
providing a stack comprising electrically conductive layer structures and at least one electrically insulating layer structure;
embedding a magnetic inlay in the stack; and
forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay such that a length of different gaps between ring segments of the magnetic inlay is at least 1 μm.