CPC H05K 1/165 (2013.01) [H01F 27/06 (2013.01); H05K 3/101 (2013.01); H05K 3/4652 (2013.01); H01F 2027/065 (2013.01); H05K 2201/086 (2013.01); H05K 2201/10265 (2013.01)] | 20 Claims |
1. A method of manufacturing a component carrier, comprising:
providing a stack comprising electrically conductive layer structures and at least one electrically insulating layer structure;
embedding a magnetic inlay in the stack; and
forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay such that a length of different gaps between ring segments of the magnetic inlay is at least 1 μm.
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