US 11,792,928 B2
Printed circuit boards with plated blind slots for improved vertical electrical and/or thermal connections
John Andrew Trelford, Richardson, TX (US); Robert Joseph Roessler, Wylie, TX (US); Jose Daniel Rogers, Mesquite, TX (US); Arturo Silva, Allen, TX (US); and Alok Lohia, Dallas, TX (US)
Assigned to Acleap Power Inc., Taipei (TW)
Filed by ABB Schweiz AG, Baden (CH)
Filed on Dec. 17, 2021, as Appl. No. 17/554,288.
Prior Publication US 2023/0199958 A1, Jun. 22, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/116 (2013.01) [H05K 1/0206 (2013.01); H05K 3/0035 (2013.01); H05K 3/0038 (2013.01); H05K 3/0047 (2013.01); H05K 3/421 (2013.01); H05K 1/184 (2013.01); H05K 3/429 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/09518 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB) comprising:
at least one insulating layer comprising a first surface and a second surface opposite the first surface;
a blind slot that is plated and formed in the at least one insulating layer, the blind slot partially extending from the first surface to the second surface, wherein the blind slot includes a conductive plating bonded along a major surface of the blind slot; and
at least one via that is electrically conductive and filled, wherein the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer, and wherein the at least one via includes a discontinuation proximate to the major surface of the blind slot where at least a portion of the at least one via has been milled and/or drilled away.