US 11,792,924 B2
Printed circuit board and manufacturing method thereof
Taehyeun Ha, Suwon-si (KR); and Taeje Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 13, 2021, as Appl. No. 17/319,633.
Application 17/319,633 is a continuation of application No. 16/439,207, filed on Jun. 12, 2019, granted, now 11,039,532.
Claims priority of application No. 10-2018-0068362 (KR), filed on Jun. 14, 2018.
Prior Publication US 2021/0282262 A1, Sep. 9, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/02 (2006.01); H01L 23/00 (2006.01); H01L 21/02 (2006.01)
CPC H05K 1/0289 (2013.01) [H01L 21/02288 (2013.01); H01L 24/26 (2013.01); H05K 1/028 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB) comprising:
a substrate;
an electrode layer formed on the substrate;
a photo solder resist (PSR) layer formed on a first area of an upper part of the electrode layer, the PSR layer having a first patterned structure; and
a conductive layer formed on the PSR layer, the conductive layer having a second patterned structure that is the same as the first patterned structure, the conductive layer being configured to conduct heat and static electricity,
wherein the electrode layer comprises a second area on which the PSR layer is not formed, and
wherein the electrode layer is directly connected with a plurality of elements through the second area, without being connected with the conductive layer.