US 11,792,921 B2
Module substrate and semiconductor module including the same
Sunki Yun, Yongin-si (KR); Kwangkyu Bang, Hwaseong-si (KR); Jihong Kim, Seongnam-si (KR); Eunji Yu, Hwaseong-si (KR); Kyungjae Kim, Hwaseong-si (KR); and Yusuf Cinar, Yongin-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Aug. 30, 2022, as Appl. No. 17/898,907.
Application 17/898,907 is a continuation of application No. 17/358,800, filed on Jun. 25, 2021, granted, now 11,490,509.
Claims priority of application No. 10-2020-0135836 (KR), filed on Oct. 20, 2020.
Prior Publication US 2022/0418097 A1, Dec. 29, 2022
Int. Cl. H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/0268 (2013.01) [H05K 1/112 (2013.01); H05K 1/141 (2013.01); H05K 1/184 (2013.01); H05K 2201/10159 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a substrate including a peripheral region;
a semiconductor device on the substrate;
a plurality of passive devices on the substrate;
at least one first terminal in the peripheral region of the substrate; and
at least one second terminal in the peripheral region of the substrate,
wherein the peripheral region of the substrate includes at least one via hole that penetrates the substrate, and at least one groove on a sidewall of the peripheral region of the substrate,
each of the at least one first terminal is on an inner wall of a corresponding via hole among the at least one via hole, and
each of the at least one second terminal is exposed through a sidewall of a corresponding groove among the at least one groove.