CPC H05K 1/0268 (2013.01) [H05K 1/112 (2013.01); H05K 1/141 (2013.01); H05K 1/184 (2013.01); H05K 2201/10159 (2013.01)] | 20 Claims |
1. A device comprising:
a substrate including a peripheral region;
a semiconductor device on the substrate;
a plurality of passive devices on the substrate;
at least one first terminal in the peripheral region of the substrate; and
at least one second terminal in the peripheral region of the substrate,
wherein the peripheral region of the substrate includes at least one via hole that penetrates the substrate, and at least one groove on a sidewall of the peripheral region of the substrate,
each of the at least one first terminal is on an inner wall of a corresponding via hole among the at least one via hole, and
each of the at least one second terminal is exposed through a sidewall of a corresponding groove among the at least one groove.
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