US 11,792,920 B2
Circuit board, semiconductor device and method of manufacturing circuit board
Shinichiro Sekijima, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on May 10, 2022, as Appl. No. 17/740,777.
Claims priority of application No. 2021-081908 (JP), filed on May 13, 2021.
Prior Publication US 2022/0369454 A1, Nov. 17, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01); H01L 23/12 (2006.01); H05K 3/42 (2006.01)
CPC H05K 1/0266 (2013.01) [H01L 23/12 (2013.01); H01L 23/49811 (2013.01); H05K 1/05 (2013.01); H05K 1/184 (2013.01); H05K 3/3452 (2013.01); H05K 3/42 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A circuit board comprising an interconnect and an insulating layer that covers the interconnect,
wherein the interconnect includes a first interconnect that is formed to serve as a recognition mark of which planar shape is a predetermined shape,
the insulating layer has a through-hole of which planar shape is variant and that penetrates the insulating layer in a thickness direction of the insulating layer such that an entire upper surface of the first interconnect is exposed, and
the through-hole includes
a first through-hole of which planar shape is a predetermined shape and that penetrates the insulating layer in the thickness direction such that the entire upper surface of the first interconnect is exposed; and
a second through-hole that serves as part of an inner wall surface of the first through-hole and that penetrates the insulating layer in the thickness direction.