US 11,792,916 B2
Printed circuit board
Jae Han Park, Suwon-si (KR); and Woo Seok Yang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jan. 3, 2022, as Appl. No. 17/567,332.
Claims priority of application No. 10-2021-0127128 (KR), filed on Sep. 27, 2021.
Prior Publication US 2023/0095087 A1, Mar. 30, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/0224 (2013.01) [H05K 1/116 (2013.01); H05K 3/107 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09636 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
an insulating layer;
a plurality of recess portions disposed on one surface of the insulating layer; and
a circuit layer disposed on the one surface of the insulating layer and including a signal pattern and a ground pattern,
wherein at least a portion of the ground pattern covers at least a portion of at least two of the plurality of recess portions, and
a depth of the plurality of recess portions is less than a thickness of the insulating layer.