US 11,792,562 B2
Headphones
Masaaki Sumi, Kyoto (JP); Hiroyuki Onitsuka, Kyoto (JP); Junya Fujita, Kyoto (JP); Takehiro Agata, Kyoto (JP); Kazuma Matsui, Kyoto (JP); and Mitsunori Sugiura, Kyoto (JP)
Assigned to OMRON CORPORATION, Kyoto (JP)
Filed by OMRON CORPORATION, Kyoto (JP)
Filed on Jan. 20, 2022, as Appl. No. 17/579,662.
Claims priority of application No. 2021-27732 (JP), filed on Feb. 24, 2021.
Prior Publication US 2022/0272434 A1, Aug. 25, 2022
Int. Cl. H04R 1/10 (2006.01); F25B 21/02 (2006.01)
CPC H04R 1/1091 (2013.01) [F25B 21/02 (2013.01); H04R 1/1008 (2013.01); H04R 1/1041 (2013.01); H04R 1/1058 (2013.01); F25B 2321/023 (2013.01); F25B 2321/0251 (2013.01)] 7 Claims
OG exemplary drawing
 
1. Headphones, comprising:
a pair of speaker units;
a pair of ear pad portions that cover at least part of user's ears;
a plurality of temperature change units that are provided inside the pair of ear pad portions, the temperature change units configured to heat and/or cool electrically so as to convey a temperature other than normal temperature to a user;
a temperature control unit configured to drive the plurality of temperature change units on a rotating basis while shifting a phase of operation individually or in groups; and
heat sinks that are disposed inside the ear pad portions and on a back surface side of the temperature change units, and have a plurality of blocks that protrude toward a side that comes into contact with the user.