US 11,792,495 B2
Imaging apparatus
Kazuki Sugaya, Tokyo (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Apr. 8, 2022, as Appl. No. 17/716,690.
Claims priority of application No. 2021-067634 (JP), filed on Apr. 13, 2021.
Prior Publication US 2022/0329713 A1, Oct. 13, 2022
Int. Cl. H04N 23/52 (2023.01); G03B 17/55 (2021.01); H04N 23/54 (2023.01); H04N 23/68 (2023.01)
CPC H04N 23/52 (2023.01) [G03B 17/55 (2013.01); H04N 23/54 (2023.01); H04N 23/687 (2023.01)] 11 Claims
OG exemplary drawing
 
1. An imaging apparatus comprising:
a movable member including an image sensor and configured to be displaced in a direction orthogonal to an optical axis;
a supporting member supporting the movable member in a movable manner;
a control substrate configured to control the movable member;
a wiring substrate having flexibility for electrically connecting the movable member and the control substrate; and
a heat transfer member having flexibility for thermally connecting the movable member and the supporting member with heat conductivity higher than heat conductivity of the wiring substrate, on a second surface side that is a side opposite of a first surface of an imaging substrate on which the image sensor is mounted,
wherein the wiring substrate includes a first electric connection portion electrically connected to the imaging substrate, a second electric connection portion electrically connected to the control substrate, and a wiring portion extending from the first electric connection portion to the second electric connection portion and including one or more bending portions,
wherein the heat transfer member includes a first heat fixing portion thermally connected to the imaging substrate, a second heat fixing portion thermally connected to the supporting member, and a heat connection portion extending from the first heat fixing portion to the second heat fixing portion and including one or more bending portions,
wherein the heat connection portion extending from the first heat fixing portion of the heat transfer member extends in the same direction as the wiring portion extending from the first electric connection portion of the wiring substrate, and
wherein, when viewed from the second surface side, the heat transfer member at least partially overlaps the wiring substrate in a portion different from an area where each of the first electric connection portion and the second electric connection portion is located.