US 11,792,015 B2
System and method for electronic signatures as a service
Santosh Kumar Das, Hyderabad (IN); Chakradhar Narasimha Jillellamudi, Hyderabad (IN); and Raghavan Muthuraman, Bangalore (IN)
Assigned to ServiceNow, Inc., Santa Clara, CA (US)
Filed by ServiceNow, Inc., Santa Clara, CA (US)
Filed on Dec. 13, 2021, as Appl. No. 17/644,053.
Application 17/644,053 is a continuation of application No. 16/294,685, filed on Mar. 6, 2019, granted, now 11,206,139.
Prior Publication US 2022/0109580 A1, Apr. 7, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04L 9/32 (2006.01); G06Q 10/10 (2023.01); H04L 9/08 (2006.01)
CPC H04L 9/3247 (2013.01) [G06Q 10/103 (2013.01); H04L 9/083 (2013.01); H04L 9/3213 (2013.01)] 17 Claims
OG exemplary drawing
 
9. A method, comprising:
creating at least one information flow object via a flow creation tool implemented using at least one processor, wherein creating the at least one information flow object comprises creating a flow designer action object configured to include a connection information and an authentication information for communicating with an electronic signature system, wherein the connection information is used to connect to the electronic signature system and the authentication information is used to authenticate to the electronic signature system;
creating an electronic signature field in the at least one information flow object using the flow creation tool;
creating an envelope having recipient information indicating a recipient with which to communicate an electronic signature request; and
providing the at least one information flow object to communicate the electronic signature request to the electronic signature system using the connection information and the authentication information.