US 11,791,605 B2
Diode laser assembly and DWM module having a diode laser assembly of this type
Christoph Tillkorn, Villingendorf (DE); Stephan Strohmaier, Berlin (DE); and Steffen Ried, Rottweil (DE)
Assigned to TRUMPF Photonics, Inc, Cranbury, NJ (US)
Appl. No. 17/254,616
Filed by TRUMPF Photonics, Inc., Cranbury, NJ (US)
PCT Filed Jun. 18, 2019, PCT No. PCT/EP2019/066006
§ 371(c)(1), (2) Date Dec. 21, 2020,
PCT Pub. No. WO2019/243325, PCT Pub. Date Dec. 26, 2019.
Claims priority of application No. 102018210139.6 (DE), filed on Jun. 21, 2018.
Prior Publication US 2021/0126426 A1, Apr. 29, 2021
Int. Cl. H01S 5/024 (2006.01); H01S 5/40 (2006.01)
CPC H01S 5/02423 (2013.01) [H01S 5/02476 (2013.01); H01S 5/4018 (2013.01); H01S 5/4031 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A diode laser configuration for a cooling of and supply of electrical current to diode laser devices, the diode laser configuration comprising:
at least two stacks each having a diode laser device configured to emit a laser beam, an upper cooling device, and a lower cooling device, wherein in each case, said diode laser device is disposed on said upper cooling device and on said lower cooling device such that said diode laser device is disposed between said upper cooling device and said lower cooling device, wherein said upper cooling device and said lower cooling device are in each case configured to cool said diode laser device disposed therebetween, wherein said upper cooling device and said lower cooling device are in each case electrically connected to said diode laser device disposed therebetween, wherein said upper cooling device and/or said lower cooling device of a stack of said stacks is in each case formed as a microchannel cooler, and wherein said upper cooling device and/or said lower cooling device of said stack in each case having substantially no electrical insulation with respect to said diode laser device disposed therebetween; and
at least one upper current bridge and/or at least one lower current bridge being in each case configured to conduct the electrical current, wherein in each case two mutually adjacently disposed upper cooling devices are disposed on said at least one upper current bridge and are electrically connected to one another via said at least one upper current bridge, and/or two mutually adjacently disposed lower cooling devices are disposed on said at least one lower current bridge and are electrically connected to one another via said at least one lower current bridge.