US 11,791,536 B2
Transmitter component, receiver component, transceiver circuit, and gate driver circuit with integrated antenna structure
Wolfgang Scherr, Villach (AT); Peter Hoffmann, Klagenfurt (AT); and Marc Tiebout, Finkenstein (AT)
Assigned to Infineon Technologies Austria AG, Villach (AT)
Filed by Infineon Technologies Austria AG, Villach (AT)
Filed on Sep. 29, 2021, as Appl. No. 17/489,661.
Claims priority of application No. 20199331 (EP), filed on Sep. 30, 2020.
Prior Publication US 2022/0102836 A1, Mar. 31, 2022
Int. Cl. H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H04B 1/10 (2006.01); H04B 1/40 (2015.01)
CPC H01Q 1/2283 (2013.01) [H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 25/105 (2013.01); H04B 1/1009 (2013.01); H04B 1/40 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/48229 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/14222 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A transmitter component, comprising:
an input terminal;
a first semiconductor portion comprising doped regions of a control-side interface circuit, wherein the control-side interface circuit is configured to convert a digital input signal received at the input terminal into a transmit radio frequency signal; and
a control-side metallization structure formed on at least one of two horizontal main surfaces of the first semiconductor portion, wherein the control-side metallization structure comprises at least a portion of a control-side antenna structure configured to emit the transmit radio frequency signal as radio wave.