US 11,791,521 B2
Electrode tabs and methods of forming
Douglas P. Riemer, Waconia, MN (US); Peter F. Ladwig, Hutchinson, MN (US); Joseph D. Starkey, Cologne, MN (US); Michael W. Davis, Rockford, MN (US); and Duane M. Jelkin, Hutchinson, MN (US)
Assigned to Hutchinson Technology Incorporated, Hutchinson, MN (US)
Filed by Hutchinson Technology Incorporated, Hutchinson, MN (US)
Filed on Sep. 10, 2020, as Appl. No. 17/17,471.
Claims priority of provisional application 62/900,419, filed on Sep. 13, 2019.
Prior Publication US 2021/0083257 A1, Mar. 18, 2021
Int. Cl. H01M 50/534 (2021.01); C25D 3/12 (2006.01); C25D 7/06 (2006.01); H01M 10/0525 (2010.01)
CPC H01M 50/534 (2021.01) [C25D 3/12 (2013.01); C25D 7/0614 (2013.01); H01M 10/0525 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A method of manufacturing, comprising:
disposing a tie layer on a second side of a base material, the base material having a first side and the second side;
disposing a first dielectric layer on the tie layer on the second side of the base material;
developing the first dielectric layer on the second side of the base material according to a first pattern;
etching at least a portion of the first side of the base material to form an electrode tab;
micro-etching the tie layer after etching the first side of the base material;
electroplating nickel on the electrode tab; and
applying a second dielectric layer on at least the portion of the first side of the base material that forms the electrode tab.