US 11,791,310 B2
Semiconductor packaging structure
Lei Shi, Nantong (CN)
Assigned to TONGFU MICROELECTRONICS CO., LTD., Nantong (CN)
Filed by TONGFU MICROELECTRONICS CO., LTD., Nantong (CN)
Filed on Aug. 27, 2021, as Appl. No. 17/458,907.
Application 17/458,907 is a division of application No. 16/393,139, filed on Apr. 24, 2019, granted, now 11,139,267.
Claims priority of application No. 201810796545.6 (CN), filed on Jul. 19, 2018.
Prior Publication US 2021/0391300 A1, Dec. 16, 2021
Int. Cl. H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01)
CPC H01L 24/96 (2013.01) [H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/78 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/067 (2013.01); H01L 2924/0695 (2013.01); H01L 2924/07025 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A packaging structure, comprising:
a substrate;
an adhesive layer formed on the substrate;
an improvement layer formed on the adhesive layer, wherein the improvement layer includes openings there-in, exposing surface portions of the adhesive layer at bottoms of the openings;
chips located in the openings, wherein the chips include functional surfaces that adhere to the adhesive layer;
an encapsulation layer, on the improvement layer and sidewalls and surfaces of the plurality of chips;
a wiring layer on the functional surfaces and a passivation layer on the wiring layer, wherein the passivation layer has solder openings exposing a portion of the wiring layer; and
solder balls in the solder openings.