CPC H01L 24/83 (2013.01) [H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 25/0657 (2013.01)] | 20 Claims |
1. A method of manufacturing a semiconductor package comprising:
arranging a wafer on an electrostatic chuck, the wafer including a plurality of base chips;
pre-bonding at least one semiconductor chip on the wafer using an adhesive film;
performing a foil lamination process to cover the at least one semiconductor chip on the wafer with a foil;
performing a pressurized reflow process, wherein the pressurized reflow process is a process of reflowing the adhesive film by applying heat while maintaining a constant pressure in a process chamber; and
removing the foil.
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