US 11,791,304 B2
Method for bonding insulated coating wire, connection structure, method for stripping insulated coating wire and bonding apparatus
Akio Sugito, Tokyo (JP); Susumu Majima, Tokyo (JP); and Mami Kushima, Tokyo (JP)
Assigned to KAIJO CORPORATION, Tokyo (JP)
Appl. No. 17/278,537
Filed by KAIJO CORPORATION, Tokyo (JP)
PCT Filed Nov. 7, 2019, PCT No. PCT/JP2019/043584
§ 371(c)(1), (2) Date Mar. 22, 2021,
PCT Pub. No. WO2020/208850, PCT Pub. Date Oct. 15, 2020.
Claims priority of application No. PCT/JP2019/015412 (WO), filed on Apr. 9, 2019.
Prior Publication US 2021/0358881 A1, Nov. 18, 2021
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/78 (2013.01) [H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 2224/4569 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/7855 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/78316 (2013.01); H01L 2224/78353 (2013.01); H01L 2224/78901 (2013.01); H01L 2224/85045 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85238 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method for bonding an insulated coating wire for electrically connecting a first electrode and a second electrode to each other by an insulated coating wire in which a metal wire is coated with an organic substance, the method comprising:
a step (a) for placing the insulated coating wire onto the first electrode;
a step (b) for exposing a metal wire from the insulated coating wire; and
a step (c) for forming a first bump over the exposed metal wire and the first electrode to electrically connect the metal wire to the first electrode.