US 11,791,296 B2
Dielectric and metallic nanowire bond layers
Scott Robert Summerfelt, Garland, TX (US); Benjamin Stassen Cook, Los Gatos, CA (US); Ralf Jakobskrueger Muenster, Saratoga, CA (US); and Sreenivasan Kalyani Koduri, Allen, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Dec. 7, 2021, as Appl. No. 17/544,888.
Application 17/544,888 is a continuation of application No. 16/843,717, filed on Apr. 8, 2020, granted, now 11,195,811.
Claims priority of provisional application 62/831,073, filed on Apr. 8, 2019.
Claims priority of provisional application 62/831,057, filed on Apr. 8, 2019.
Prior Publication US 2022/0102307 A1, Mar. 31, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/13 (2013.01) [H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13078 (2013.01); H01L 2224/279 (2013.01); H01L 2224/29078 (2013.01); H01L 2224/3207 (2013.01); H01L 2224/83895 (2013.01); H01L 2224/83896 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of forming an electronic device, the method comprising:
providing a first die including a first surface and a second die including a second surface; and
positioning a bond layer positioned between the first surface and the second surface, the bond layer including a set of metallic wires and a dielectric portion, the dielectric portion comprising a polymer matrix and dielectric nanoparticles.