CPC H01L 23/66 (2013.01) [H01L 23/49822 (2013.01); H01L 23/562 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01)] | 20 Claims |
1. A semiconductor device, comprising:
an antenna zone comprising an antenna layer, a first insulation layer, and a second insulation layer between the antenna layer and the first insulation layer, wherein a thickness of the first insulation layer is different from a thickness of the second insulation layer;
a semiconductor component disposed adjacent to the first insulation layer;
a first protection layer encapsulating the semiconductor component;
a connector adjacent to the semiconductor component, wherein a portion of the connector is exposed from the first protection layer; and
a second protection layer covering the antenna zone.
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