CPC H01L 23/562 (2013.01) [H01L 21/4825 (2013.01); H01L 21/78 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 23/49582 (2013.01); H01L 23/3736 (2013.01); H01L 23/49579 (2013.01); H01L 24/03 (2013.01); H01L 24/45 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00 (2013.01)] | 20 Claims |
1. A reinforced semiconductor die comprising:
a substrate comprising a die; and
a metal plate coupled over the substrate, the metal plate comprising a plurality of tie bars extending from a plurality of sides of the metal plate;
wherein the die is configured to be electrically coupled to a wire through the metal plate.
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