US 11,791,288 B2
Reinforced semiconductor die and related methods
Chee Hiong Chew, Seremban (MY); Erik Nino Tolentino, Seremban (MY); Yusheng Lin, Phoenix, AZ (US); and Swee Har Khor, Kuala Lumpur (MY)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Apr. 27, 2022, as Appl. No. 17/660,941.
Application 16/886,395 is a division of application No. 16/181,876, filed on Nov. 6, 2018, granted, now 10,700,018, issued on Jun. 30, 2020.
Application 17/660,941 is a continuation of application No. 16/886,395, filed on May 28, 2020, granted, now 11,348,878.
Prior Publication US 2022/0254734 A1, Aug. 11, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 21/78 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 21/4825 (2013.01); H01L 21/78 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 23/49582 (2013.01); H01L 23/3736 (2013.01); H01L 23/49579 (2013.01); H01L 24/03 (2013.01); H01L 24/45 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A reinforced semiconductor die comprising:
a substrate comprising a die; and
a metal plate coupled over the substrate, the metal plate comprising a plurality of tie bars extending from a plurality of sides of the metal plate;
wherein the die is configured to be electrically coupled to a wire through the metal plate.