US 11,791,282 B2
Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same
Jaekyung Yoo, Seoul (KR); Yeongkwon Ko, Hwaseong-si (KR); Jayeon Lee, Seongnam-si (KR); Jaeeun Lee, Hwaseong-si (KR); and Teakhoon Lee, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Oct. 29, 2020, as Appl. No. 17/83,932.
Claims priority of application No. 10-2020-0085061 (KR), filed on Jul. 10, 2020.
Prior Publication US 2022/0013474 A1, Jan. 13, 2022
Int. Cl. H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/49833 (2013.01); H01L 25/0652 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a substrate;
an interposer on the substrate;
a first underfill between the substrate and the interposer;
at least one logic chip and at least one memory stack on the interposer; and
a molding material on the interposer while surrounding a side surface of the at least one logic chip and a side surface of the at least one memory stack,
the molding material including areas having different heights, and
a region of the first underfill covering a portion of the molding material such that the region of the first underfill extends over an upper surface of the portion of the molding material and over an upper surface of a portion of the interposer,
the upper surface of the portion of the molding material being opposite a lower surface of the portion of the molding material, and
the lower surface of the portion of molding material being on the upper surface of the interposer, wherein
the molding material comprises a reference area and at least one recess area,
a height of the at least one recess area is lower than a height of the reference area,
the at least one recess area is outside the reference area,
the first underfill overflows up to the at least one recess area,
the first underfill comprises a first horizontal surface contacting an upper surface of the at least one recess area and a second horizontal surface, the second horizontal surface being parallel to the first horizontal surface and opposite the first horizontal surface.