US 11,791,244 B2
Semiconductor-module external terminal
Hiroko Mori, Osaka (JP)
Assigned to SANSHA ELECTRIC MANUFACTURING CO., LTD., Osaka (JP)
Appl. No. 17/603,254
Filed by Sansha Electric Manufacturing Co., Ltd., Osaka (JP)
PCT Filed Dec. 23, 2019, PCT No. PCT/JP2019/050285
§ 371(c)(1), (2) Date Oct. 12, 2021,
PCT Pub. No. WO2020/213214, PCT Pub. Date Oct. 22, 2020.
Claims priority of application No. 2019-079866 (JP), filed on Apr. 19, 2019.
Prior Publication US 2022/0199495 A1, Jun. 23, 2022
Int. Cl. H01L 23/492 (2006.01); H01R 12/55 (2011.01)
CPC H01L 23/492 (2013.01) [H01R 12/55 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A semiconductor-module external terminal that is an external terminal soldered vertically to a substrate disposed inside a semiconductor module, the semiconductor-module external terminal comprising:
a bottom portion to be soldered; and
a terminal body vertically bent from the bottom portion, wherein:
the terminal body includes a first groove on a left end side and a second groove on a right end side of a bending portion which is bent immediately above the bottom portion; the first and the second grooves being notches cut from an outside of the terminal body toward a center line that passes vertically through the terminal body; and
the first groove and the second groove are asymmetrical with respect to the center line passing the terminal body in a vertical direction.