CPC H01L 23/492 (2013.01) [H01R 12/55 (2013.01)] | 7 Claims |
1. A semiconductor-module external terminal that is an external terminal soldered vertically to a substrate disposed inside a semiconductor module, the semiconductor-module external terminal comprising:
a bottom portion to be soldered; and
a terminal body vertically bent from the bottom portion, wherein:
the terminal body includes a first groove on a left end side and a second groove on a right end side of a bending portion which is bent immediately above the bottom portion; the first and the second grooves being notches cut from an outside of the terminal body toward a center line that passes vertically through the terminal body; and
the first groove and the second groove are asymmetrical with respect to the center line passing the terminal body in a vertical direction.
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