US 11,791,179 B2
Substrate treating apparatus and substrate treating method
Bu Yong Chang, Chungcheongnam-do (KR)
Assigned to Semes Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Nov. 13, 2019, as Appl. No. 16/682,326.
Claims priority of application No. 10-2018-0159796 (KR), filed on Dec. 12, 2018.
Prior Publication US 2020/0192308 A1, Jun. 18, 2020
Int. Cl. H01L 21/67 (2006.01); G05B 15/02 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67167 (2013.01) [G05B 15/02 (2013.01); H01L 21/68707 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a process module configured to perform processing on a substrate;
an index module configured to insert the substrate into the process module and withdraw the substrate, of which the processing is completed, from the process module;
a loading module configured to relay the substrate between the process module in a vacuum atmosphere and the index module in an atmospheric pressure atmosphere by switching an atmosphere thereof to the vacuum atmosphere or the atmospheric pressure atmosphere; and
a control module that receives operation states from the process module, the index module, and the loading module only when changes in the respective operation states occur, and schedules operations of the process module, the index module, and the loading module in a direction in which the number of substrates to be processed per unit time increases with reference to the received operation states.