US 11,791,173 B2
Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment
Seung Hoon Choi, Suwon-si (KR); Ja Eung Koo, Suwon-si (KR); No Ui Kim, Suwon-si (KR); Hyun Kyo Seo, Suwon-si (KR); Tae Min Earmme, Suwon-si (KR); Bo Un Yoon, Suwon-si (KR); and Youn Cheol Jeong, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jan. 13, 2020, as Appl. No. 16/741,002.
Claims priority of application No. 10-2019-0032129 (KR), filed on Mar. 21, 2019; and application No. 10-2019-0085475 (KR), filed on Jul. 16, 2019.
Prior Publication US 2020/0303218 A1, Sep. 24, 2020
Int. Cl. H01L 21/67 (2006.01); H01L 21/02 (2006.01); B24B 37/34 (2012.01)
CPC H01L 21/67051 (2013.01) [B24B 37/34 (2013.01); H01L 21/02057 (2013.01); H01L 21/02096 (2013.01); H01L 21/67046 (2013.01)] 15 Claims
OG exemplary drawing
 
1. Substrate cleaning equipment, comprising:
a substrate holder which supports a substrate;
a swing body which moves along a sweep line on a main surface of the substrate, wherein the swing body includes a first surface facing the main surface of the substrate;
a head which is coupled to the swing body and comprises a pad attachment surface facing the substrate holder, wherein the head is disposed on the first surface of the swing body;
a first cleaning liquid supply structure which is coupled to the swing body and sprays a first cleaning liquid onto the main surface of the substrate; and
a second cleaning liquid supply structure which is coupled to the swing body and sprays a second cleaning liquid onto the main surface of the substrate,
wherein a buffing pad is attached to the pad attachment surface,
wherein the first cleaning liquid supply structure comprises a first nozzle arm movably coupled to the swing body and a first cleaning liquid supply nozzle coupled to the first nozzle arm,
wherein the first nozzle arm is directly attached to and extends from the first surface of the swing body toward the main surface of the substrate,
wherein the second cleaning liquid supply structure comprises a second nozzle arm movably coupled to the swing body and a second cleaning liquid supply nozzle coupled to the second nozzle arm,
wherein the first nozzle arm is movable in a first straight line on the first surface of the swing body, and the second nozzle arm is movable in a second straight line on the first surface of the swing body, and
wherein the first straight line along which the first nozzle arm is movable is orthogonal to the second straight line along which the second nozzle arm is movable.