US 11,791,097 B2
Ceramic electronic component
Su Been Kim, Suwon-si (KR); Jong Hoon Yoo, Suwon-si (KR); Kyung Ryul Lee, Suwon-si (KR); Hyung Joon Jeon, Suwon-si (KR); Jin Woo Kim, Suwon-si (KR); and Jong Suk Jeong, Suwon-si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Oct. 13, 2021, as Appl. No. 17/500,311.
Claims priority of application No. 10-2020-0178791 (KR), filed on Dec. 18, 2020.
Prior Publication US 2022/0199326 A1, Jun. 23, 2022
Int. Cl. H01G 4/12 (2006.01); C04B 35/468 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01)
CPC H01G 4/1227 (2013.01) [C04B 35/4682 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01); C01P 2002/34 (2013.01); C04B 2235/78 (2013.01)] 38 Claims
OG exemplary drawing
 
1. A ceramic electronic component comprising:
a body including dielectric layers and internal electrodes; and
external electrodes disposed on the body and connected to the internal electrodes,
wherein the dielectric layer includes a plurality of dielectric crystal grains,
at least one of the plurality of dielectric crystal grains has a core-double shell structure comprising a core and a double shell,
the double shell of the core-double shell structure includes a first shell surrounding at least a portion of the core and a second shell surrounding at least a portion of the first shell,
the first shell includes one or more of a first element selected from the group consisting of Sn, Sb, Ge, Si, Ga, In, and Zr, and
the second shell includes a second element of one or more of Ca or Sr.