US 11,791,095 B2
Multilayer electronic component
Min Jung Cho, Suwon-si (KR); and Yu Hong Oh, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 24, 2021, as Appl. No. 17/410,328.
Claims priority of application No. 10-2020-0154771 (KR), filed on Nov. 18, 2020.
Prior Publication US 2022/0157525 A1, May 19, 2022
Int. Cl. H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01); H01G 4/248 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/0085 (2013.01) [H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/2325 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and
an external electrode disposed on the body and connected to the internal electrodes,
wherein one of the internal electrodes includes Ni, and
wherein a lattice constant of Ni included in the one of the internal electrodes satisfies a range of 3.53 Å to 3.72 Å.