CPC H01F 41/041 (2013.01) [H01F 17/0013 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 41/046 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 28/10 (2013.01); H01F 41/04 (2013.01); H01F 2017/0066 (2013.01); H01F 2027/2809 (2013.01)] | 19 Claims |
1. A substrate for a packaging application, comprising:
a plurality of polymer layers disposed atop a substrate base;
a stacked spiral inductor coil disposed within the plurality of polymer layers and extending vertically through multiple layers of the plurality of polymer layers; and
at least one magnetic core disposed through the plurality of polymer layers and within a central region defined by the stacked spiral inductor coil; and
a plurality of magnetic cores comprising vias disposed around and outside of the stacked spiral inductor coil.
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