US 11,791,094 B2
Semiconductor substrate having magnetic core inductor
Peng Suo, Singapore (SG); Yu Gu, Singapore (SG); Guan Huei See, Singapore (SG); and Arvind Sundarrajan, Singapore (SG)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed on Apr. 11, 2021, as Appl. No. 17/227,332.
Application 17/227,332 is a division of application No. 16/056,847, filed on Aug. 7, 2018, granted, now 11,373,803.
Claims priority of provisional application 62/544,744, filed on Aug. 11, 2017.
Prior Publication US 2021/0233707 A1, Jul. 29, 2021
Int. Cl. H01F 27/00 (2006.01); H01F 41/04 (2006.01); H01F 17/00 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 49/02 (2006.01)
CPC H01F 41/041 (2013.01) [H01F 17/0013 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 41/046 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 28/10 (2013.01); H01F 41/04 (2013.01); H01F 2017/0066 (2013.01); H01F 2027/2809 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate for a packaging application, comprising:
a plurality of polymer layers disposed atop a substrate base;
a stacked spiral inductor coil disposed within the plurality of polymer layers and extending vertically through multiple layers of the plurality of polymer layers; and
at least one magnetic core disposed through the plurality of polymer layers and within a central region defined by the stacked spiral inductor coil; and
a plurality of magnetic cores comprising vias disposed around and outside of the stacked spiral inductor coil.