US 11,790,939 B1
Heat sinking layer between a substrate and encasing layers of a recording head
Helene Parwana Habibi, Londonderry (GB); Vasudevan Ramaswamy, Chaska, MN (US); Raul H. Andruet, Woodbury, MN (US); Neil Zuckerman, Eden Prairie, MN (US); Frank A. McGinnity, Eglinton (GB); Giovanni A. Badini Confalonieri, Londonderry (GB); Martin L. McGarry, Ballymena (GB); James G. Wessel, Savage, MN (US); and Pablo G. Levi, Saint Paul, MN (US)
Assigned to Seagate Technology LLC, Fremont, CA (US)
Filed by Seagate Technology LLC, Fremont, CA (US)
Filed on Jan. 3, 2022, as Appl. No. 17/567,511.
Application 17/567,511 is a continuation of application No. 17/116,107, filed on Dec. 9, 2020, granted, now 11,217,273.
This patent is subject to a terminal disclaimer.
Int. Cl. G11B 5/31 (2006.01); G11B 5/00 (2006.01); G11B 5/60 (2006.01); G11B 5/48 (2006.01)
CPC G11B 5/314 (2013.01) [G11B 5/3163 (2013.01); G11B 5/4866 (2013.01); G11B 5/6088 (2013.01); G11B 2005/0021 (2013.01)] 20 Claims
OG exemplary drawing
 
7. A method of making a recording head, the method comprising:
forming a substrate;
forming a heat sinking layer over the substrate; and
forming an electrically insulative layer over the heat sinking layer,
wherein the substrate is formed of a first material, the electrically insulative layer is formed of a second material that is different from the first material, and the heat sinking layer is formed of a third material that is different from the first and second materials, wherein the third material has a third thermal conductivity that is higher than at least one of a first thermal conductivity of the first material or a second thermal conductivity of the second material.