US 11,790,071 B2
Embedded trace capacitive signet stamp
Thomas Ree Worley, Alpharetta, GA (US); Jesse Edward Stewart, Portland, OR (US); Alex Norman Haines, Beaverton, OR (US); Sheradyn Thomas Mikul, Wausau, WI (US); and Charles Alan McAllister, Portland, OR (US)
Assigned to SnowShoeFood, Inc., Portland, OR (US)
Filed by SnowShoeFood Inc., Portland, OR (US)
Filed on Feb. 7, 2022, as Appl. No. 17/666,535.
Application 17/666,535 is a continuation of application No. 16/626,870, granted, now 11,328,046, previously published as PCT/US2018/040247, filed on Jun. 29, 2018.
Claims priority of provisional application 62/527,151, filed on Jun. 30, 2017.
Prior Publication US 2022/0164428 A1, May 26, 2022
Int. Cl. G06F 21/34 (2013.01); G06K 7/08 (2006.01)
CPC G06F 21/34 (2013.01) [G06K 7/081 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An embedded trace capacitive signet stamp comprising:
a substrate;
a plurality of conductive points affixed with the substrate;
a user contact area that allows a user to provide capacitance to the conductive points;
a conductive layer connecting each conductive point to the user contact area; and
a tamper resistant protective layer that covers the conductive points from view and causes damage to the embedded trace capacitive signet stamp if tampered with.