US 11,789,505 B2
Loop heat pipe
Takeshi Shioga, Atsugi (JP); and Yoshihiro Mizuno, Kobe (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Apr. 15, 2021, as Appl. No. 17/231,205.
Application 17/231,205 is a continuation of application No. 15/156,869, filed on May 17, 2016, granted, now 11,009,927.
Application 15/156,869 is a continuation of application No. PCT/JP2013/083504, filed on Dec. 13, 2013.
Prior Publication US 2021/0232189 A1, Jul. 29, 2021
Int. Cl. G06F 1/20 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); H01L 23/427 (2006.01); F28F 3/08 (2006.01)
CPC G06F 1/203 (2013.01) [F28D 15/0266 (2013.01); F28D 15/043 (2013.01); F28D 15/046 (2013.01); H01L 23/427 (2013.01); F28F 3/086 (2013.01); H01L 2224/16225 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A loop heat pipe comprising:
an evaporator configured to vaporize a working fluid;
a condenser configured to liquefy the working fluid;
a liquid line connecting the evaporator and the condenser; and
a vapor line connecting the evaporator and the condenser; wherein
the evaporator, the condenser, the liquid line, and the vapor line form a loop-shaped flow path through which the working fluid flows;
the evaporator, the condenser, the liquid line, and the vapor line are formed by stacking a lowermost metallic layer, an uppermost metallic layer, and an intermediate layer set provided between the uppermost metallic layer and the lowermost metallic layer, the intermediate layer set being formed of a plurality of metallic layers including a first metallic layer and a second metallic layer provided on the first metallic layer;
the first metallic layer includes
a pair of first walls forming walls of the evaporator, the condenser, the liquid line, and the vapor line,
a first opening penetrating the first metallic layer, and
a second opening penetrating the first metallic layer;
the second metallic layer includes
a pair of second walls forming walls of the evaporator, the condenser, the liquid line, and the vapor line,
a third opening penetrating the second metallic layer, and
a fourth opening penetrating the second metallic layer;
the first opening and the third opening are disposed to coincide with each other in a plan view;
the second opening and the fourth opening are disposed to partially overlap each other in a plan view, such that the second opening is in communication with the fourth opening;
the first opening and the third opening form a first portion of the flow path;
the second opening and the fourth opening form a second portion of the flow path; and
the communication between the second opening and the fourth opening is narrower than the communication between the first opening and the third opening.