US 11,789,439 B2
Failure sign diagnosis device and method therefor
Junsuke Fujiwara, Tokyo (JP); Hideaki Suzuki, Tokyo (JP); Toshiaki Kono, Tokyo (JP); and Toshiyuki Odaka, Tokyo (JP)
Assigned to HITACHI, LTD., Tokyo (JP)
Appl. No. 17/609,938
Filed by Hitachi, Ltd., Tokyo (JP)
PCT Filed Apr. 24, 2020, PCT No. PCT/JP2020/017676
§ 371(c)(1), (2) Date Nov. 9, 2021,
PCT Pub. No. WO2020/255560, PCT Pub. Date Dec. 24, 2020.
Claims priority of application No. 2019-114195 (JP), filed on Jun. 20, 2019.
Prior Publication US 2022/0244719 A1, Aug. 4, 2022
Int. Cl. G05B 23/02 (2006.01)
CPC G05B 23/0283 (2013.01) [G05B 23/0281 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A failure sign diagnosis device for performing failure sign diagnosis on an instrument using sensor data obtained from the instrument with the use of a plurality of sensors, comprising:
processed sensor data generation means for generating processed sensor data by performing processing on the sensor data;
preprocessing condition generation means for generating processing conditions for the processing that increases correlation coefficients between the plurality of sensors as preprocessing conditions;
failure sign diagnosis model update means for updating a failure sign diagnosis model of the instrument on the basis of the preprocessing conditions;
diagnosis processing means for performing failure sign diagnosis on the instrument using the failure sign diagnosis model; and
sensor combination generation means for generating sensor combinations on the basis of correlation coefficients between the sensor data and the processed sensor data,
wherein the preprocessing condition generation means generates the preprocessing condition for each of the sensor combinations generated by the sensor combination generation means.