US 11,789,365 B2
Substrate processing method and substrate processing apparatus
Ryu Komatsu, Atsugi Kanagawa (JP); Takeharu Motokawa, Zushi Kanagawa (JP); Noriko Sakurai, Yokohama Kanagawa (JP); and Hideaki Sakurai, Kawasaki Kanagawa (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by KIOXIA CORPORATION, Tokyo (JP)
Filed on Feb. 28, 2020, as Appl. No. 16/804,981.
Claims priority of application No. 2019-168735 (JP), filed on Sep. 17, 2019.
Prior Publication US 2021/0080831 A1, Mar. 18, 2021
Int. Cl. G03F 7/20 (2006.01); H01L 21/027 (2006.01); G03F 7/00 (2006.01); G03F 7/38 (2006.01); G03F 7/16 (2006.01)
CPC G03F 7/2041 (2013.01) [G03F 7/162 (2013.01); G03F 7/2004 (2013.01); G03F 7/38 (2013.01); G03F 7/70341 (2013.01); H01L 21/0271 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A method for processing a substrate, comprising:
forming a pattern on a substrate;
supplying a liquid consisting of purified water or carbonated water to cover the pattern; and
after supplying the liquid, irradiating the pattern with a light through the liquid, the light causing near-field light to be generated selectively around uneven portions of the pattern, the generated near-field light causing active species to be generated from the liquid around the pattern and planarization of the pattern with the generated active species,
wherein the light has a wavelength that does not cause dissociation of water molecules.