US 11,789,364 B2
Apparatus for treating substrate and method for treating substrate
Hyun Min Kim, Suwon-si (KR); and Young Seo An, Osan-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Dec. 29, 2021, as Appl. No. 17/564,604.
Claims priority of application No. 10-2020-0187533 (KR), filed on Dec. 30, 2020.
Prior Publication US 2022/0206391 A1, Jun. 30, 2022
Int. Cl. G03F 7/16 (2006.01)
CPC G03F 7/16 (2013.01) 16 Claims
OG exemplary drawing
 
1. An apparatus for treating a substrate comprising:
a process chamber configured to have a treating space therein;
a support member located in the treating space to support the substrate; and
a gas supply unit configured to supply a surface-modifying gas to the treating space,
wherein the gas supply unit comprises:
a bubbler tank provided with an accommodating space for storing a liquid alkyne-based chemical and configured to bubble the liquid alkyne-based chemical by supplying inert gas to the accommodating space to generate the surface-modifying gas;
a heater configured to heat the liquid alkyne-based chemical stored in the bubbler tank at a first temperature; and
a gas supply line coupled between the process chamber and the bubbler tank to supply the surface-modifying gas to the treating space and provided with a first valve, and
wherein the first temperature is increased to a temperature immediately before a boiling temperature of the liquid alkyne-based chemical.