US 11,789,221 B2 | ||
Techniques for device cooling in an optical sub-assembly | ||
Zhizhong Tang, San Carlos, CA (US); Wenjing Liang, San Jose, CA (US); Kevin Kinichi Masuda, Alhambra, CA (US); and Pradeep Srinivasan, Fremont, CA (US) | ||
Assigned to Aeva, Inc., Mountain View, CA (US) | ||
Filed by AEVA, INC., Mountain View, CA (US) | ||
Filed on Oct. 5, 2021, as Appl. No. 17/494,415. | ||
Prior Publication US 2023/0103569 A1, Apr. 6, 2023 | ||
Int. Cl. G02B 6/42 (2006.01); H01S 5/024 (2006.01); G02B 6/43 (2006.01); H01L 23/38 (2006.01); H01L 33/64 (2010.01); H10N 19/00 (2023.01) |
CPC G02B 6/4271 (2013.01) [H01L 33/645 (2013.01); H01S 5/02415 (2013.01); G02B 6/43 (2013.01); H01L 23/38 (2013.01); H10N 19/00 (2023.02)] | 18 Claims |
1. An optical sub-assembly with efficient heat dissipation from the heat generating components, comprising:
a housing comprising one or more electrical connections; a thermoelectric cooler (TEC) mounted to the housing and in electrical contact with the housing; a light emitting diode that emits an optical beam; a photonics die comprising a waveguide, wherein the optical beam emitted by the light emitting diode exits the optical sub-assembly via the waveguide; a thermally conductive underfill disposed between the photonics die and the TEC to facilitate heat transfer between the light emitting diode and the photonics die; wherein the TEC comprises a top surface and a bottom surface such that the bottom surface of the TEC is attached to the housing and the top surface of the TEC is attached to the light emitting diode; wherein the photonics die is attached to the TEC, with the light emitting diode and the underfill interposed therebetween, such that a first surface of the light emitting diode is in direct contact with the TEC and a second surface of the light emitting diode opposite the first surface of the light emitting diode is in direct contact with the with photonics die; and wherein the photonics die is offset from the TEC in a horizontal direction, providing an overhang of the photonics die over the TEC, such that the underfill does not interfere with the optical beam exiting the waveguide. |