US 11,789,221 B2
Techniques for device cooling in an optical sub-assembly
Zhizhong Tang, San Carlos, CA (US); Wenjing Liang, San Jose, CA (US); Kevin Kinichi Masuda, Alhambra, CA (US); and Pradeep Srinivasan, Fremont, CA (US)
Assigned to Aeva, Inc., Mountain View, CA (US)
Filed by AEVA, INC., Mountain View, CA (US)
Filed on Oct. 5, 2021, as Appl. No. 17/494,415.
Prior Publication US 2023/0103569 A1, Apr. 6, 2023
Int. Cl. G02B 6/42 (2006.01); H01S 5/024 (2006.01); G02B 6/43 (2006.01); H01L 23/38 (2006.01); H01L 33/64 (2010.01); H10N 19/00 (2023.01)
CPC G02B 6/4271 (2013.01) [H01L 33/645 (2013.01); H01S 5/02415 (2013.01); G02B 6/43 (2013.01); H01L 23/38 (2013.01); H10N 19/00 (2023.02)] 18 Claims
OG exemplary drawing
 
1. An optical sub-assembly with efficient heat dissipation from the heat generating components, comprising:
a housing comprising one or more electrical connections;
a thermoelectric cooler (TEC) mounted to the housing and in electrical contact with the housing;
a light emitting diode that emits an optical beam;
a photonics die comprising a waveguide, wherein the optical beam emitted by the light emitting diode exits the optical sub-assembly via the waveguide;
a thermally conductive underfill disposed between the photonics die and the TEC to facilitate heat transfer between the light emitting diode and the photonics die;
wherein the TEC comprises a top surface and a bottom surface such that the bottom surface of the TEC is attached to the housing and the top surface of the TEC is attached to the light emitting diode;
wherein the photonics die is attached to the TEC, with the light emitting diode and the underfill interposed therebetween, such that a first surface of the light emitting diode is in direct contact with the TEC and a second surface of the light emitting diode opposite the first surface of the light emitting diode is in direct contact with the with photonics die; and
wherein the photonics die is offset from the TEC in a horizontal direction, providing an overhang of the photonics die over the TEC, such that the underfill does not interfere with the optical beam exiting the waveguide.