CPC G02B 6/4215 (2013.01) [G02B 6/29304 (2013.01); G02B 6/424 (2013.01); G02B 6/4239 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/167 (2013.01); H01S 5/0234 (2021.01); H01S 5/02218 (2021.01); H01L 2224/0557 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/81986 (2013.01)] | 38 Claims |
1. A three-dimensional packaging method of a photonic-electronic chip, comprising:
providing a photonic chip with a first surface and a second surface which are opposite to each other;
fixing a dummy chip on a second area of the first surface of the photonic chip, wherein the photonic chip is provided with an optical coupling interface at the second area, and the dummy chip has a single cavity with a single-sided opening, and the opening of the cavity faces and covers all of the optical coupling interface;
forming an injection molding material layer on the photonic chip on which the dummy chip is fixed, so that the injection molding material layer covers the dummy chip and the exposed areas of the first surface of the photonic chip; and
thinning the injection molding material layer and the dummy chip, so that the cavity of the dummy chip is connected up and down.
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