US 11,789,199 B2
Chip heat dissipation structure and liquid crystal display device
Zheng Zhou, Wuhan (CN); and Suimang Song, Wuhan (CN)
Appl. No. 16/972,622
Filed by WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Wuhan (CN)
PCT Filed Oct. 30, 2020, PCT No. PCT/CN2020/125292
§ 371(c)(1), (2) Date Dec. 7, 2020,
PCT Pub. No. WO2022/082849, PCT Pub. Date Apr. 28, 2022.
Claims priority of application No. 202011138491.8 (CN), filed on Oct. 22, 2020.
Prior Publication US 2022/0317363 A1, Oct. 6, 2022
Int. Cl. F21V 8/00 (2006.01); H05K 7/20 (2006.01); G02F 1/1335 (2006.01); G02F 1/1333 (2006.01)
CPC G02B 6/0085 (2013.01) [G02F 1/133314 (2021.01); G02F 1/133382 (2013.01); G02F 1/133628 (2021.01); H05K 7/2039 (2013.01); G02B 6/0088 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A chip heat dissipation structure, wherein the chip heat dissipation structure comprises a chip contact end and a backplate contact end, the chip heat dissipation structure is made of thermal conductive material, the backplate is a backplate of a bottom of a backlight module under a display panel of a liquid crystal display device;
wherein the chip heat dissipation structure comprises:
a first surface serving as a chip contact end, located above the backlight module and the display panel, covering the chip, and contacting the chip in area;
a second surface serving as a backplate contact end, located under the backlight module and the display panel, paralleling the first surface, and contacting the backplate in area; and
a third surface connected a side edge of the first surface opposite to the third surface;
wherein a gap is defined in the second surface and divides the second surface into two portions.