US 11,789,093 B1
Three-axis measurement modules and sensing methods
Mark S. Olsson, La Jolla, CA (US); Allen P. Hoover, San Diego, CA (US); Sequoyah Aldridge, San Diego, CA (US); and Stephanie M. Bench, Atlanta, GA (US)
Assigned to SEESCAN, INC., San Diego, CA (US)
Filed by SeeScan, Inc., San Diego, CA (US)
Filed on Nov. 11, 2021, as Appl. No. 17/523,910.
Application 17/523,910 is a continuation of application No. 16/178,494, filed on Nov. 1, 2018, granted, now 11,187,761.
Claims priority of provisional application 62/580,386, filed on Nov. 1, 2017.
Int. Cl. G01V 3/08 (2006.01); G01R 33/02 (2006.01); G01R 33/00 (2006.01); G01C 9/00 (2006.01); G01P 15/18 (2013.01)
CPC G01R 33/0206 (2013.01) [G01C 9/00 (2013.01); G01P 15/18 (2013.01); G01R 33/0082 (2013.01); G01V 3/081 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A measurement module, comprising:
a substrate;
three or more integrated circuit sensors for generating output signals based on a sensed parameter;
a mounting element disposed on the substrate, the mounting element shaped and sized to position the integrated circuit sensors in a predefined pattern; and
a temperature sensor for providing temperature output data usable to compensate for temperature variations in a parameter measured by the integrated circuit sensors, wherein the temperature sensor is positioned in close proximity to a central measurement point (centroid) shared by the integrated circuit sensors.