US 11,788,835 B2
Apparatus for measuring sample thickness and method for measuring sample thickness
Seonghyeon Cheon, Gwacheon-si (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by Samsung Display Co., Ltd., Yongin-Si (KR)
Filed on May 15, 2019, as Appl. No. 16/412,706.
Claims priority of application No. 10-2018-0094214 (KR), filed on Aug. 13, 2018.
Prior Publication US 2020/0049496 A1, Feb. 13, 2020
Int. Cl. G01B 17/02 (2006.01); F25D 19/00 (2006.01); G01N 29/07 (2006.01); G01N 29/32 (2006.01)
CPC G01B 17/025 (2013.01) [F25D 19/00 (2013.01); G01B 17/02 (2013.01); G01N 29/07 (2013.01); G01N 29/32 (2013.01); G01N 29/326 (2013.01); G01N 2291/0234 (2013.01); G01N 2291/02854 (2013.01); G01N 2291/048 (2013.01); G01N 2291/101 (2013.01); G01N 2291/102 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus for measuring thickness of an object comprising:
a chamber;
a sound wave transmitter transmitting a sound wave in the chamber;
a sound wave receiver receiving the sound wave transmitted from the sound wave transmitter in the chamber;
a supporter disposed between the sound wave transmitter and the sound wave receiver, and supporting the object;
a cooler which cools the chamber at a temperature lower than or equal to about minus 170 degrees Celsius when measuring the thickness of the object; and
a controller connected to the sound wave receiver and receiving a sound wave reception signal from the sound wave receiver, the controller calculating the thickness of the object.