	US 11,787,989 B2
	Heat transfer methods, systems and compositions
Ankit Sethi, Buffalo, NY (US); Samuel F. Yana Motta, East Amherst, NY (US); Elizabet del Carmen Vera Becerra, Amherst, NY (US); Yang Zou, Buffalo, NY (US); Henna Tangri, Williamsville, NY (US); and Gregory L. Smith, Niagara Falls (CA)
Assigned to HONEYWELL INTERNATIONAL INC., Charlotte, NC (US)
Filed by HONEYWELL INTERNATIONAL INC., Morris Plains, NJ (US)
Filed on May 18, 2021, as Appl. No. 17/322,945.
Application 17/322,945 is a division of application No. 16/135,962, filed on Sep. 19, 2018, granted, now 11,008,494.
Claims priority of provisional application 62/587,600, filed on Nov. 17, 2017.
Claims priority of provisional application 62/560,558, filed on Sep. 19, 2017.
Prior Publication US 2021/0355358 A1, Nov. 18, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. F25B 9/00 (2006.01); C09K 5/04 (2006.01)

CPC C09K 5/045 (2013.01) [C09K 2205/122 (2013.01); C09K 2205/24 (2013.01); F25B 9/006 (2013.01)]

17 Claims

1. A method for providing heat transfer of the type comprising evaporating refrigerant liquid to produce a refrigerant vapor, compressing in a compressor at least a portion of the refrigerant vapor and condensing refrigerant vapor in the condenser in a plurality of repeating cycles, said method comprising:

(a) providing a refrigerant comprising at least about 5% by weigh of a lower alkyl iodofluorocarbon;

(b) optionally providing lubricant for said compressor; and

(b) exposing at least a portion of said refrigerant and/or at least a portion of said lubricant in at least a portion of said plurality of said cycles to a sequestration material included in a filtration element, said sequestration material comprising one or more of:

i. copper or a copper alloy,

ii. activated alumina

iii. a zeolite molecular sieve comprising copper, silver, lead or a combination thereof,

iv an anion exchange resin, and

v. a moisture-removing material,

wherein said sequestration material comprises at least activated alumina and

wherein said exposing temperature is above about 10° C.