US 11,787,978 B2
Product assembly adhesives comprising low volatile tackifier compositions
Bing Yuan, Methuen, MA (US); James Palmer Dickerson, Kingsport, TN (US); Bee Kim Liew, Kingsport, TN (US); Christopher Wayne Osborne, Johnson City, TN (US); and Jacobus Siera, Hoogerheide (NL)
Assigned to Synthomer Adhesive Technologies LLC, Beachwood, OH (US)
Filed by Synthomer Adhesive Technologies LLC, Beachwood, OH (US)
Filed on Jan. 29, 2020, as Appl. No. 16/775,948.
Claims priority of provisional application 62/841,507, filed on May 1, 2019.
Claims priority of provisional application 62/841,515, filed on May 1, 2019.
Claims priority of provisional application 62/841,511, filed on May 1, 2019.
Claims priority of provisional application 62/841,498, filed on May 1, 2019.
Claims priority of provisional application 62/799,383, filed on Jan. 31, 2019.
Prior Publication US 2020/0248043 A1, Aug. 6, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. C09J 7/35 (2018.01); C09J 11/08 (2006.01); C09J 11/06 (2006.01); C09J 123/26 (2006.01); A61L 15/20 (2006.01); A61L 15/58 (2006.01); A61L 15/22 (2006.01); C09J 153/02 (2006.01); C09J 153/00 (2006.01); C09J 123/08 (2006.01); C08K 5/17 (2006.01); C08L 91/06 (2006.01); C08K 3/013 (2018.01); C08K 5/00 (2006.01); C08K 5/3435 (2006.01); C08K 5/13 (2006.01); C08K 5/375 (2006.01); C08K 5/372 (2006.01); C08K 5/3492 (2006.01); C08K 5/134 (2006.01); C08K 5/52 (2006.01); C08K 5/5393 (2006.01); C09J 7/38 (2018.01); C08L 23/08 (2006.01); C08L 23/26 (2006.01); C08L 53/02 (2006.01); C08K 5/105 (2006.01); C08K 5/12 (2006.01)
CPC C09J 7/35 (2018.01) [A61L 15/20 (2013.01); A61L 15/225 (2013.01); A61L 15/585 (2013.01); C08K 3/013 (2018.01); C08K 5/0016 (2013.01); C08K 5/13 (2013.01); C08K 5/1345 (2013.01); C08K 5/17 (2013.01); C08K 5/3435 (2013.01); C08K 5/3492 (2013.01); C08K 5/372 (2013.01); C08K 5/375 (2013.01); C08K 5/52 (2013.01); C08K 5/5393 (2013.01); C08L 23/0853 (2013.01); C08L 23/26 (2013.01); C08L 53/02 (2013.01); C08L 91/06 (2013.01); C09J 7/381 (2018.01); C09J 11/06 (2013.01); C09J 11/08 (2013.01); C09J 123/0815 (2013.01); C09J 123/0853 (2013.01); C09J 123/26 (2013.01); C09J 153/00 (2013.01); C09J 153/02 (2013.01); C08K 5/005 (2013.01); C08K 5/105 (2013.01); C08K 5/12 (2013.01); C08K 5/34926 (2013.01); C09J 2301/408 (2020.08); C09J 2301/414 (2020.08); C09J 2453/00 (2013.01)] 14 Claims
 
1. A product assembly hot melt adhesive composition, comprising:
about 5 parts to about 90 parts of at least at least one base polymer comprising at least one amorphous polyolefin,
about 5 parts to about 90 parts of at least one tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition, wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed,
about 0 parts to about 50 parts of at least one plasticizing oil,
about 0 parts to about 50 parts of at least one wax,
about 0 parts to about 80 parts of at least one filler, and
at least one additional antioxidant;
wherein the antioxidant composition comprises at least one primary antioxidant, at least one secondary antioxidant, and at least one hindered amine light stabilizer (HALS);
wherein said primary antioxidant is a hindered phenolic antioxidant or a secondary arylamine, and wherein said primary antioxidant is present in an amount of about 0.1% to about 1% based on the weight of the thermoplastic hydrocarbon resin;
wherein said secondary antioxidant is an organo-phosphite or a hydroxyl-amine, and wherein said secondary antioxidant is present in an amount of about 0.1% to about 1% based on the weight of said thermoplastic hydrocarbon resin;
wherein when said primary antioxidant is a hindered phenolic antioxidant, then said secondary antioxidant is a hydroxyl-amine;
wherein when said secondary antioxidant is an organo-phosphite, then said primary antioxidant is a secondary arylamine;
wherein said thermoplastic hydrocarbon resin is a fully hydrogenated or partially hydrogenated C9 resin; and
wherein the levels of individual volatile organic compounds in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis.