US 11,787,974 B2
Chemical-mechanical polishing particle and polishing slurry composition comprising same
Weoun Gyuen Moon, Hwaseong-si (KR); Jae Hyun Kim, Hwaseong-si (KR); Kyu Soon Shin, Hwaseong-si (KR); Jong Dai Park, Hwaseong-si (KR); Min Gun Lee, Hwaseong-si (KR); Sung Hoon Jin, Hwaseong-si (KR); Goo Hwa Lee, Hwaseong-si (KR); Gyeong Sook Cho, Hwaseong-si (KR); and Jae Hong Yoo, Hwaseong-si (KR)
Assigned to Dongjin Semichem Co., Ltd., Incheon (KR)
Filed by Dongjin Semichem Co., Ltd., Incheon (KR)
Filed on Jun. 30, 2021, as Appl. No. 17/363,105.
Application 17/363,105 is a continuation of application No. PCT/KR2019/018546, filed on Dec. 27, 2019.
Claims priority of application No. 10-2018-0173796 (KR), filed on Dec. 31, 2018.
Prior Publication US 2021/0340405 A1, Nov. 4, 2021
Int. Cl. C09G 1/02 (2006.01); C09K 3/14 (2006.01)
CPC C09G 1/02 (2013.01) [C09K 3/1436 (2013.01)] 9 Claims
OG exemplary drawing
 
1. Chemical-mechanical polishing (CMP) particles comprising:
polishing particles; and
at least one aluminum cluster coated on the surface of each of the polishing particles,
wherein the number of pKa peaks of the polishing particles coated with the at least one aluminum cluster, obtained by a back titration method, is one or more, and one or more of pKa values of the peaks range from 4.3 to 4.9, and
wherein the polishing particles coated with the at least one aluminum cluster have a zeta potential of 40 mV or higher.