US 11,787,942 B2
Polyimide precursor solution, method for producing porous polyimide film, porous polyimide film, and insulated wire
Shigeru Seitoku, Kanagawa (JP); Kosuke Nakada, Kanagawa (JP); Takeshi Iwanaga, Kanagawa (JP); and Hidekazu Hirose, Kanagawa (JP)
Assigned to FUJIFILM Business Innovation Corp., Tokyo (JP)
Filed by FUJIFILM Business Innovation Corp., Tokyo (JP)
Filed on Feb. 3, 2022, as Appl. No. 17/591,983.
Claims priority of application No. 2021-143868 (JP), filed on Sep. 3, 2021.
Prior Publication US 2023/0080755 A1, Mar. 16, 2023
Int. Cl. C08L 79/08 (2006.01); H01B 3/30 (2006.01); C08J 9/26 (2006.01)
CPC C08L 79/08 (2013.01) [C08J 9/26 (2013.01); H01B 3/306 (2013.01); C08J 2201/046 (2013.01); C08J 2367/02 (2013.01); C08J 2379/08 (2013.01); C08L 2203/16 (2013.01); C08L 2203/202 (2013.01); C08L 2205/18 (2013.01); C08L 2205/22 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A polyimide precursor solution comprising:
a polyimide precursor;
polyester resin particles containing a polyester resin and having a volume average particle diameter of from 25 μm to 35 μm inclusive and an average circularity of 0.985 or more; and
a solvent.