US 11,787,690 B1
MEMS assembly substrates including a bond layer
Sung Bok Lee, Chicago, IL (US); John Szczech, Schaumburg, IL (US); and Josh Watson, Aurora, IL (US)
Assigned to KNOWLES ELECTRONICS, LLC., Itasca, IL (US)
Filed by Knowles Electronics, LLC, Itasca, IL (US)
Filed on Apr. 2, 2021, as Appl. No. 17/221,479.
Claims priority of provisional application 63/005,162, filed on Apr. 3, 2020.
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01); H04R 19/04 (2006.01); H04R 31/00 (2006.01)
CPC B81C 1/00325 (2013.01) [B81B 7/0048 (2013.01); H04R 19/04 (2013.01); H04R 31/006 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81C 2203/0792 (2013.01); H04R 2201/003 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a micro electro mechanical system (MEMS) assembly, the method comprising:
providing a substrate having an electrically conductive layer disposed thereon;
depositing, on the substrate over the electrically conductive layer, a bonding material having an elastic modulus of less than 500 MPa so as to form a bond layer;
completely curing the bond layer; and
attaching a MEMS die to the completely cured bond layer.