US 11,787,194 B2
Sealed interconnects
Anthony Donald Studer, Albany, OR (US); David Olsen, Corvallis, OR (US); Quinton Buford Weaver, Albany, OR (US); and Brian Allen Nichols, Albany, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 17/294,969
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Jul. 18, 2019, PCT No. PCT/US2019/042466
§ 371(c)(1), (2) Date May 18, 2021,
PCT Pub. No. WO2020/117323, PCT Pub. Date Jun. 11, 2020.
Claims priority of application No. PCT/US2018/063624 (WO), filed on Dec. 3, 2018; application No. PCT/US2018/063630 (WO), filed on Dec. 3, 2018; application No. PCT/US2018/063631 (WO), filed on Dec. 3, 2018; application No. PCT/US2018/063638 (WO), filed on Dec. 3, 2018; application No. PCT/US2018/063643 (WO), filed on Dec. 3, 2018; and application No. PCT/US2019/026145 (WO), filed on Apr. 5, 2019.
Prior Publication US 2022/0009238 A1, Jan. 13, 2022
Int. Cl. B41J 2/175 (2006.01); B41J 29/393 (2006.01); G01L 23/08 (2006.01); G06F 13/42 (2006.01); G06F 21/44 (2013.01); G06K 15/00 (2006.01); B33Y 50/00 (2015.01); G03G 15/08 (2006.01); G06K 15/10 (2006.01); G06F 9/30 (2018.01); G06F 21/62 (2013.01); H04L 9/08 (2006.01); H04L 9/32 (2006.01)
CPC B41J 2/17546 (2013.01) [B33Y 50/00 (2014.12); B41J 2/1752 (2013.01); B41J 2/1753 (2013.01); B41J 2/17513 (2013.01); B41J 2/17523 (2013.01); B41J 2/17526 (2013.01); B41J 2/17553 (2013.01); B41J 2/17556 (2013.01); B41J 2/17559 (2013.01); B41J 2/17566 (2013.01); B41J 29/393 (2013.01); G01L 23/08 (2013.01); G03G 15/0856 (2013.01); G03G 15/0863 (2013.01); G06F 9/30105 (2013.01); G06F 13/42 (2013.01); G06F 13/4282 (2013.01); G06F 21/44 (2013.01); G06F 21/62 (2013.01); G06K 15/102 (2013.01); G06K 15/4075 (2013.01); H04L 9/0819 (2013.01); H04L 9/3242 (2013.01); B41J 2002/17516 (2013.01); B41J 2002/17579 (2013.01); B41J 2002/17586 (2013.01); B41J 2202/13 (2013.01); B41J 2202/20 (2013.01); G05B 2219/49023 (2013.01); G06F 2213/0016 (2013.01); G06F 2213/40 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A print liquid supply unit, comprising:
an electrical interconnect sealed in a supply joint and extending through the supply joint from an outside of the supply unit to an inside of the supply unit, wherein the supply joint is welded to join housing components of the supply unit.