US 11,787,126 B2
Bonding system and bonding method
Kenji Furuyashiki, Tokyo (JP); Hiroshi Yuchi, Tokyo (JP); Satoshi Hirawaki, Wako (JP); Yoshinori Yamamori, Tokyo (JP); Takayuki Mori, Kariya (JP); Yoshihiro Iwano, Toyota (JP); and Kazuaki Amaoka, Nagoya (JP)
Assigned to TOYOTA CUSTOMIZING & DEVELOPMENT CO., LTD., Yokohama (JP); AISIN SEIKI KABUSHIKI KAISHA, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY, Nagoya (JP); TORAY INDUSTRIES, INC., Tokyo (JP); TEIJIN LIMITED, Osaka (JP); KOMATSU LTD., Tokyo (JP); and SUBARU CORPORATION, Tokyo (JP)
Appl. No. 16/499,220
Filed by Toyota Customizing & Development Co., Ltd., Yokohama (JP); Honda Motor Co., Ltd., Tokyo (JP); Aisin Seiki Kabushiki Kaisha, Kariya (JP); Toyota Jidosha Kabushiki Kaisha, Toyota (JP); National University Corporation Nagoya University, Nagoya (JP); Toray Industries, Inc., Tokyo (JP); Teijin Limited, Osaka (JP); Komatsu Ltd., Tokyo (JP); and Subaru Corporation, Tokyo (JP)
PCT Filed Mar. 23, 2018, PCT No. PCT/JP2018/011930
§ 371(c)(1), (2) Date Feb. 3, 2021,
PCT Pub. No. WO2018/181073, PCT Pub. Date Oct. 4, 2018.
Claims priority of application No. 2017-065548 (JP), filed on Mar. 29, 2017.
Prior Publication US 2021/0162681 A1, Jun. 3, 2021
Int. Cl. B29C 65/02 (2006.01); B29C 65/00 (2006.01); B29C 65/08 (2006.01); B29C 65/32 (2006.01); B29C 65/78 (2006.01); B29L 31/30 (2006.01)
CPC B29C 66/863 (2013.01) [B29C 65/02 (2013.01); B29C 65/08 (2013.01); B29C 65/32 (2013.01); B29C 65/7841 (2013.01); B29C 66/91411 (2013.01); B29L 2031/30 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A bonding system comprising:
a supporting jig having a mounting surface including a plurality of bonding supporting surfaces on which bonding substrates are mounted, wherein at least two of the bonding supporting surfaces have different normal directions angled relative to each other at 90 degrees or less;
a stand configured to support a portion of the supporting jig;
a turning bearing disposed between the stand and the supporting jig;
a spring-loaded ball roller disposed between the stand and the supporting jig, the spring-loaded ball roller spaced a distance from the turning bearing;
a bonding device that sandwiches and welds the bonding substrates between the bonding device and the mounting surface;
an articulated robot to which the bonding device is attached, the articulated robot configured to move the bonding device;
a temperature adjustment device that adjusts a temperature of the mounting surface; and
a control unit configured to control the articulated robot and the bonding device to move the bonding device to the plurality of bonding supporting surfaces and weld the bonding substrates thereon.