CPC B29C 66/863 (2013.01) [B29C 65/02 (2013.01); B29C 65/08 (2013.01); B29C 65/32 (2013.01); B29C 65/7841 (2013.01); B29C 66/91411 (2013.01); B29L 2031/30 (2013.01)] | 14 Claims |
1. A bonding system comprising:
a supporting jig having a mounting surface including a plurality of bonding supporting surfaces on which bonding substrates are mounted, wherein at least two of the bonding supporting surfaces have different normal directions angled relative to each other at 90 degrees or less;
a stand configured to support a portion of the supporting jig;
a turning bearing disposed between the stand and the supporting jig;
a spring-loaded ball roller disposed between the stand and the supporting jig, the spring-loaded ball roller spaced a distance from the turning bearing;
a bonding device that sandwiches and welds the bonding substrates between the bonding device and the mounting surface;
an articulated robot to which the bonding device is attached, the articulated robot configured to move the bonding device;
a temperature adjustment device that adjusts a temperature of the mounting surface; and
a control unit configured to control the articulated robot and the bonding device to move the bonding device to the plurality of bonding supporting surfaces and weld the bonding substrates thereon.
|